JPH0325416Y2 - - Google Patents
Info
- Publication number
- JPH0325416Y2 JPH0325416Y2 JP17176485U JP17176485U JPH0325416Y2 JP H0325416 Y2 JPH0325416 Y2 JP H0325416Y2 JP 17176485 U JP17176485 U JP 17176485U JP 17176485 U JP17176485 U JP 17176485U JP H0325416 Y2 JPH0325416 Y2 JP H0325416Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- semiconductor device
- boiling
- cooling body
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 6
- 239000003507 refrigerant Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17176485U JPH0325416Y2 (en]) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17176485U JPH0325416Y2 (en]) | 1985-11-08 | 1985-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6280341U JPS6280341U (en]) | 1987-05-22 |
| JPH0325416Y2 true JPH0325416Y2 (en]) | 1991-06-03 |
Family
ID=31107691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17176485U Expired JPH0325416Y2 (en]) | 1985-11-08 | 1985-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325416Y2 (en]) |
-
1985
- 1985-11-08 JP JP17176485U patent/JPH0325416Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6280341U (en]) | 1987-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213635964U (zh) | 一种散热增强功率模块 | |
| WO2023019754A1 (zh) | 冷板装置及服务器 | |
| JPS583383B2 (ja) | サイリスタスタツク | |
| JPH0325416Y2 (en]) | ||
| US3086283A (en) | Method for improving assembly of heat exchanger for semiconductors | |
| JPH0157503B2 (en]) | ||
| JP2562180B2 (ja) | 沸騰冷却形半導体装置 | |
| CN222981887U (zh) | 一种散热面带u型槽的3dvc均热板 | |
| JPS6144450Y2 (en]) | ||
| JPS6345004Y2 (en]) | ||
| JPS6397292U (en]) | ||
| JPS6320101Y2 (en]) | ||
| CN221632406U (zh) | 一种电容器散热结构 | |
| JPH04196154A (ja) | 半導体冷却装置 | |
| JPH0254955A (ja) | 沸騰冷却形半導体装置 | |
| JP3173764B2 (ja) | 沸騰冷却装置 | |
| JPS5834761Y2 (ja) | 半導体素子の冷却装置 | |
| JPH08178559A (ja) | 熱交換装置 | |
| JP2757893B2 (ja) | 平型半導体素子 | |
| JP3494196B2 (ja) | 沸騰冷却装置 | |
| JP2512140Y2 (ja) | 放熱器 | |
| JPH0337245Y2 (en]) | ||
| JPH08255857A (ja) | 沸騰冷却装置 | |
| CN116709736A (zh) | 一种高压直流输电换流阀冷却系统 | |
| JPS58177950U (ja) | 沸騰冷却装置 |